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Phoenix Contact 1714936

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Phoenix Contact 1714936

Brand Name : 1714936

Description : Copper alloy 2 -55℃~+125℃ 1.27mm Surface Mount,Vertical SMD Headers, Male Pins RoHS

Mounting Type : Surface Mount,Vertical

Number of Rows : 2

Model Number : 1714936

MOQ : 280

Packaging Details : SMD

Stock : 28000

Row Spacing : 1.27mm

Contact Material : Copper alloy

Delivery Time : 16-30 weeks

Operating Temperature : -55℃~+125℃

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Phoenix Contact FINEPITCH Series Board-to-Board Connectors

Product Overview

The Phoenix Contact FINEPITCH series offers robust board-to-board connectors for signal and data transmission in compact designs. Available in shielded and unshielded versions, these connectors support individual PCB orientations with various designs, stack heights, and numbers of positions. The FINEPITCH 0.8 mm series, featuring ScaleX technology, provides high-speed data transmission up to 16 Gbps and excellent EMC properties, optimized for automated processing. The FINEPITCH 1.27 mm series offers flexible solutions for connecting multiple PCBs, supporting various configurations like coplanar, mezzanine, and mother-daughter connections, with stack heights ranging from 8 mm to 13.8 mm.

Product Attributes

  • Brand: Phoenix Contact
  • Series: FINEPITCH
  • Material: Cu alloy (live metal parts), LCP (insulation material)
  • Contact Surface Finish: Ni; Au or Ni; PdNi; Au or Ni; NiP; Au
  • Soldering Area Surface Finish: Sn
  • Insulation Material Group: IIIa
  • Resistance to Creepage (CTI): 150 (FINEPITCH 0.8), 175 (FINEPITCH 1.27)
  • Flammability Rating: UL 94 V0
  • Moisture Sensitivity Level (MSL): 1
  • Certifications: UL 1977
  • Compliance: WEEE/RoHS-compliant, free of whiskers
  • Origin: Germany

Technical Specifications

Specification FINEPITCH 0.8 FINEPITCH 1.27
Pitch 0.8 mm 1.27 mm
Number of Positions 12, 20, 32, 52, 80 (Others on request) 12, 16, 20, 26, 32, 40, 50, 68, 80
Data Transmission Speed Up to 16 Gbps N/A (Focus on general connectivity)
Nominal Current (at 20C) 1.4 A (52-pos.) 1.4 A (50-pos.)
Insulation Resistance Min. 5 G Min. 10 G
Contact Resistance Max. 20 m Max. 25 m
Test Voltage 500 V AC 500 V AC
Air Clearances and Creepage Distances Min. 0.25 mm Min. 0.4 mm
Temperature Limits (Operation) -55C to +125C -55C to +125C
Insertion and Withdrawal Force per Contact 1.2 N Approx. 0.5 N
Service Life 500 insertion cycles (Performance Level I) 500 insertion cycles (Performance Level I)
Coplanarity 0.1 mm 0.1 mm
Stack Heights (FINEPITCH 0.8) 6 to 12 mm N/A
Stack Heights (FINEPITCH 1.27) N/A 8 mm to 13.8 mm
EMC Properties Shielded versions available (excellent EMC) N/A (Focus on general connectivity)
ScaleX Technology Yes N/A
Wipe Length 1.5 mm 1.5 mm
Center Offset Tolerance 0.7 mm 0.7 mm
Inclination Tolerance 2/4 4 (longitudinal), 2 (oblique)
Process Note SMD soldering (IPC/JEDEC J-STD-020D.1) SMD soldering (IPC/JEDEC J-STD-020D.1)
Packaging Tape-on-reel Tape-on-reel, tray, bag (pre-assembled)

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